摘要
本文综述了Si3N4/Si3N4陶瓷连接的研究现状,论述不同连接工艺对接头强度的影响。
The recent developments in joining of silicon nitride to itself are reviewed. The effects of dissimilar joining techniques on bonding strength are discussed.
出处
《硅酸盐通报》
CAS
CSCD
1997年第2期41-46,共6页
Bulletin of the Chinese Ceramic Society