摘要
论述了研磨液在硅单晶片加工中所起的重要作用以及当今国内外研磨液的发展状况 ,通过实验研究有效地解决了目前研磨液存在的悬浮、金属离子的去除及表面颗粒吸附问题 ,并对研磨液的污染及其净化处理进行了分析。
The act on grinding fluid in the silicon wafer pro duction and the development of grinding fluid at home and abroad was expounded. Many experiments were accomplished to solve the problems effectively wh ich includes suspending, eliminating the metal ion, the absorbing of particles o n the surface. The pollution and purify was analyzed.
出处
《稀有金属》
EI
CAS
CSCD
北大核心
2001年第6期431-433,共3页
Chinese Journal of Rare Metals
