摘要
集成电路的可靠性和成品率是制约半导体制造发展的两个主要因素 .如何表征可靠性和成品率之间的关系是一个非常重要的问题 .本文利用一种离散的成品率模型导出了二者的关系式 ,该关系式不仅考虑了线宽、线间距等版图的几何信息同时还考虑了与工艺有关的缺陷粒径分布等参数 .通过模拟实验给出了该模型的有效性验证 .
Yield and reliability are two important factors affecting the development of semiconductor manufacturing. It is an important problem how to express the relation between yield and reliability. A discrete yield model is given between yield and reliability, with many factors considered in this model, such as the line width, the spacing between the lines as well as the distribution of the defect size and so on. Finally, the validity of this model is shown by simulation.
出处
《电子学报》
EI
CAS
CSCD
北大核心
2001年第11期1515-1518,共4页
Acta Electronica Sinica
基金
国家"九五"科技攻关项目 (No .96 738 0 1 0 3 1 0 )
国防科技基金(No.8.5 .3 .4)
关键词
可靠性
成品率
离散模型
集成电路
Computer simulation
Mathematical models
Reliability
Semiconductor device manufacture
