摘要
较详细地论述了新型硅铝(Al-70%Si)合金的制备、机械加工及焊接性能、物理性能。应用 Osprey 喷射沉积成形技术开发出的新型硅铝(Al-70%Si)合金,晶粒细小,微观结构各向同性,可用一般刀具机加工,机加工后的表面可以镀镍、铜、银和金,电镀层与基体结合牢固,在450℃不会开裂;硅铝合金的热传导率及热膨胀系数与半导体的相近,并有其它优良性能,与传统的电子封装材料相比有更好的应用价值。
Aluminium-silicon alloy(A1-70%Si)has been developed using the Osprey method.This high-sili- con alloy has a fine,isotropic microstructure.This alloy cart be readily machined using conventional carbide tools and is easily plated with nickel,copper,silver and gold.The electroplated layers remain adherent and blister-free up to 450℃.The characterization of the alloys in terms of its resistivity,thermal conductivity and thermal expansivity is de- scribed.The methodology for fabricating electronics packages is also discussed.
出处
《材料导报》
EI
CAS
CSCD
2001年第6期18-20,17,共4页
Materials Reports
