摘要
利用喷射成形技术制备了70Si30Al合金,研究了合金的显微组织演变,检测了合金的热膨胀系数和热导率,用三点弯曲法测试了合金的弯曲强度。结果表明,喷射成形70Si30Al合金经热压后的组织结构为连接成网状的近球形硅相和穿插于其中的二次富铝相。合金具有低密度(2.42g·cm-3)、高弯曲强度(180MPa)、低热膨胀系数(6.9×10-6/K)、高热导率(118W·m-·1K-1),硬度BH=261的特点,是一种性能优良的电子封装材料。
70Si30Al alloy was fabricated by the spray atomization and deposition technique. The microstructure and properties of the alloy were studied; the coefficient of thermal expansion, thermal conductivity measurements, and 3-point bending tests were conducted. The results showed that the microstructure of the alloy after hot pressing was composed of a continuous network of globular primary phase of Si and interpenetrating secondary phase rich in Al. The property measure ment results indicated that the spray-deposited 70Si30Al alloy had the advantage of physical and mechanical characteristics, such as low coefficient of thermal expansion（6.9 × 10^-6/K）, high thermal conductivity （118 W.mK^-1）, low density （2.42 g·cm^-3）, high ultimate flexural strength （180 MPa） and Brinell hardness （261）. So the spray-formed 70Si30Al alloy after densification was a kind of excellent electronic packaging material.
出处
《稀有金属》
EI
CAS
CSCD
北大核心
2009年第5期742-745,共4页
Chinese Journal of Rare Metals
基金
国家高技术研究发展计划项目(2007AA03Z515)资助
