摘要
本文介绍了溶胶—凝胶法在电子陶瓷材料制备中的应用 ,阐述了两大类型 :胶体凝胶法和聚合凝胶法 ,后者又分为无机聚合网络凝胶法和有机聚合网络凝胶法 ,简单探讨了它们各自的适用范围。
This paper reviews the application of sol gel routes to the preparation of electrical ceramic materials,Colloidal gel and polymeric gel methods were described in detail.The latter can also be classified into inorganic polymeric gel derived from organometallic compounds and gel routes involving formation of organic polymeric glass.The specific applications are briefly discussed.Some technology problems in the preparation of electrical ceramic materials,for example,the prevention of the powder agglomeration and the development mechanism of cracks of the film are discussed here.
出处
《山东陶瓷》
CAS
2001年第1期11-15,共5页
Shandong Ceramics
基金
广东省自然科学基金项目
关键词
溶胶-凝胶法
电子陶瓷
粉体团聚
裂纹
陶瓷膜
The sol gel routes
Electrical ceramics
Powder agglomeration
Cracks in the film
