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烧结温度和复压复烧对温压制备Cu-Ti_3SiC_2材料的影响 被引量:4

Effect of sinter temperature and double-press double-sinter on warm compaction prepared pure Cu-Ti_3SiC_2 composite
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摘要 以Cu和表面镀有Cu的Ti3SiC2粉末为原料,采用温压压制成形和复压复烧技术制备一系列Cu-Ti3SiC2复合材料,研究不同烧结温度、Ti3SiC2含量以及复压复烧对材料性能的影响。采用XRD衍射仪、环块式摩擦磨损试验机等测试手段,研究Cu-Ti3SiC2复合材料的物相组成和摩擦磨损行为。研究结果表明:以800℃烧结可制得不含杂质的纯Cu-Ti3SiC2复合材料;而以1 000℃烧结制得的复合材料中含有TiC和TiSi2杂质,这些杂质可影响材料的导电性能和减摩能力。复压复烧可使材料的密度、硬度以及导电性能得到不同程度的提高,尤其对于高Ti3SiC2含量的材料,其作用更为明显。 Using Cu and Cu coated Ti3SiC2 powders as raw materials, a series of Cu-Ti3SiC2 composites were prepared by employing warm compaction forming and double-press double-sinter techniques. Effects of sinter temperature, Ti3SiC2 content and double-press double-sinter on the properties of the prepared composites were studied. Composition and tribological behavior of the Cu-Ti3SiC2 composites were studied by X-ray diffractometer and a block-on-ring tribotester,respectively. Results show that Cu-Ti3SiC2 composites without impurity can be fabricated by sintering at 800℃; however, composites obtained by sintering at 1 000 ℃ contain TiC and TiSi2 impurities, which eventually impose adverse effect on the electrical conductivity and anti-friction ability of the composite. Double-press double-sinter can improve the density, hardness and electrical conductivity of the composites to certain degree, especially for the composite with high Ti3SiC2 content.
出处 《粉末冶金材料科学与工程》 EI 北大核心 2014年第2期197-204,共8页 Materials Science and Engineering of Powder Metallurgy
基金 国家自然科学基金资助项目(51074077)
关键词 TI3SIC2 复合材料 热稳定性 Cu Cu composite thermal stability
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