摘要
军用和民用微型电子产品的MCM、HIC等复杂混合电路正在越来越多地采用裸芯片,然而,裸芯片由于尺寸小、电路密集、焊盘间距小等原因,在进行组装的过程中一旦有微量的污染物出现,就会对裸芯片的应用造成较大影响。气相清洗通过清洗溶剂蒸汽在组件表面冷凝,形成液体滴下带走污染物,避免了传统的通过机械力、超声振动等清洗方式对裸芯片造成的不可修复的损伤。对限幅二极管砷化镓裸芯片、硅基裸芯片进行气相清洗,有效除去裸芯片表面的污染物,具有无损高效的特点。
Military and consumer electronic product makes bare chips more and more directly apply to MCM, HIC and other complex mixing circuit. However, because of the small size and tight pitch of bare chip, the contaminants on bare chip from the process of mounted and rework process has great influence on circuit performance, and must be removed. Vapor cleaning let solvent rise in a vapor state, and return to liquid when it encounters a cold module, discharge the contaminants, make bare chip avoid the irreparable damage caused by mechanical force, ultrasonic vibration cleaning methods. Vapor cleaning which was used to Si and GaAs chips can effectively and non-destructively remove contaminants on bare chip surface.
出处
《电子工艺技术》
2014年第2期84-87,共4页
Electronics Process Technology
基金
国防基础科研项目(项目编号:A1120110020)
