摘要
射频识别(RFID)标签的封装中,芯片与天线靠各向异性导电胶(ACA)连接。ACA的性质导致了芯片的引脚与天线连接处会有较大的阻抗,影响了标签的电参数,会对标签读写距离产生不利的影响。分析了芯片引脚处阻抗对标签的电性能的影响,对该处电阻与寄生电容进行了建模和计算。最后,依据理论计算了一款天线的引脚阻抗,并据此对该天线进行了优化与测试,验证了理论的正确性。
In the packaging of radio frequency identification （RFID） tags, IC and antenna are interconnected with anisotropic conductive adhesive （ACA）, the property of ACA will led to a impedance at the pins of IC, and will affect the electrical parameters of the tag, which adversely affect the reading distance of tags. Analyzed how pin impedance affect the electrical properties of RFID tags, theoretically explained how the resistance and parasitic capacitance formed, and how can they be calculated. Finally, based on the theory calculated and optimized an antenna, the test results have verified the correctness of the theory.
出处
《电子工艺技术》
2014年第2期63-65,106,共4页
Electronics Process Technology
基金
国家重大专项基金项目(项目编号2012ZX04010-071)
