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一种应用于ACA固化的热压装置设计 被引量：1

Design of a Thermocompression Bonding Equipment Used for ACA Curing
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摘要 设计了一种基于ACA互连工艺,用于RFID标签制造的热压装置,建立了热压固化装置集中参数模型,通过模型计算了不同工作温度下,固化装置参考点温度和不同区域的热流大小,应用有限元分析软件ANSYS,对该模型的稳态热性能进行了数值分析,并与实际测量数据和集中参数模型的计算结果进行了对比,证明了集中参数模型的有效性,根据计算结果对固化装置的设计方案进行了分析,指出了影响固化装置热学性能的主要因素。 Design a bonding equipment used for RFID tag manufacturing based on ACA interconnection technology. A lumped - parameter model of the bonding equipment is verified both analytically presented,the model was and experimentally by using ANSYS to do numerical analysis on steady thermal performance and measuring temperature. Points out the main factors influence the equipment＇s thermal performance based on the computational result of the lumped - parameter model.
作者 郑堃 吴金波 尹周平 王正家
机构地区 华中科技大学
出处 《机械与电子》 2006年第7期26-29,共4页 Machinery & Electronics
基金 国家"九七三"资助项目(2003CB716207) 全国优秀博士论文专项资金(200329)
关键词 各项异性导电胶 热压 集中参数模型 有限元分析 ACA thermocompression lumped-parameter model finite element analysis
分类号 TB131 [理学—应用物理]
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参考文献5

  • 1吴丰顺,郑宗林,吴懿平,邬博义,陈力.倒装芯片封装材料—各向异性导电胶的研究进展[J].电子工艺技术,2004,25(4):139-142. 被引量：14
  • 2Lai Zonghe, Liu Johan. Anisotropically conductive adhesive flip - chip bonding on rigid and flexible printed circuit substrates[J]. IEEE Trans on Components,Packaging, and Manufacturing Technology, 1996, 19(3) :644-660.
  • 3Chan Y C,Luk D Y. Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects flip - chip - on - flex packages assembly. Ⅰ different bonding temperature[J]. Microelectronic Reliability, 2002,42: 1185 - 1194.
  • 4Chan Y C,Luk D Y. Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects flip - chip - on - flex packages assembly. Ⅱ different bonding pressure[J]. Microelectronic Reliability, 2002,42 : 1195 - 1204.
  • 5John H Lienhard I V, John H Lienhard V. A heat transfer textbook, 3rd Edition[M]. Phlogiston Press,Cambridge Massachusetts, 2005.

二级参考文献15

  • 1Chan Y C,Luk D Y.Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly II Different bonding pressure[J].Microelectronics reliability,2002,42:1195-1204.
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  • 7Miessner R,Aschenbrenner R,Reichl H.Reliability study of flip chip on FR4 interconnections with ACA [C].Electronic components and technology conference,2002.595-601.
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  • 9Miho Yamaguchi.Development of noval anisotropic conductive file(ACF)[C].Electronic components and technology conference,1999.360-364.
  • 10Jean-charles Sourian,cyrille Rossat.Electronical conductive film for Flip-chip interconnection based on Z-aixs conductors [C].Electronic components and technology conference,2002.1151-1153.

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机械与电子
2006年 第7期

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