摘要
通过分析键合工艺参数,为25μm Au丝引线键合的应用提供实验依据。采用正交试验法对键合工艺参数进行试验研究。起决定性作用的是因素间的交互作用和劈刀的安装长度,其次为压力、超声功率、超声时间、热台温度、劈刀温度。各因素影响力大小为A>B>F>C>D>E,较优工艺方案为"A_2B_2C_1D_2E_1F_1",回归模型为Y=13.124+0.731A-0.393B-0.057C+0.022D+0.013F。除以上主要影响因素,Au丝弧度也是需要考虑的。给进一步研究引线键合提供重要依据。
By analyzing the bonding parameter, the experimental basis is given for 25 μm gold wire bonding application. The bonding parameter was researched by orthogonal test. The main factors effected on the bonding quality are the interaction and mounted length of capillary, and the pressure, ultrasonic power, ultrasonic time, the temperature of heating stage, the temperature of capillary are also the effect factors. The level of influencing factor is A 〉 B 〉 F 〉 C 〉 D 〉 E, the better solution is ＂A2B2C1D2E1F1＇＇, the regression model is Y = 13.124 ＋ 0.731A - 0.393B - 0.057C ＋ 0.022D ＋ 0.013F. The radian of gold wire is necessary to be considered besides the above-mentioned influence factors.
出处
《半导体技术》
CAS
CSCD
北大核心
2010年第4期369-372,共4页
Semiconductor Technology
关键词
金丝
引线键合
正交试验
键合工艺参数
劈刀
超声
gold wire
wire bonding
orthogonal test
bonding parameter
capillary
ultrasonic
