摘要
采用热阻分析法和CFD软件Fluent数值模拟相结合,研究风扇结构即风扇通风直径或外壳厚度以及肋片高度对芯片散热器散热能力的影响。结果表明,较小的通风直径导致肋片散热能力下降的根本原因为回流区面积的增加和空气流量的减小。此外,肋高的改变直接导致了流道几何参数的改变,进而对表面对流传热系数产生了重大的影响。
The thermal resistance theory and numerical simulation were made on the thermal analysis of the fan structure and rib height of the chip radiator. The results show that smaller diameter of the ventilation cause heat capacity drops because of the in- verse flow area increase and the air flow rate reduce, further more, the rib height play an important role in the flow road geome- try, and it has a great effect on the convective heat transfer coefficient.
出处
《流体机械》
CSCD
北大核心
2013年第12期60-64,73,共6页
Fluid Machinery
基金
国家自然科学基金资助项目(51276118)
上海理工大学博士启动资金项目
关键词
风扇结构
肋高
散热性能
数值模拟
Fluent软件
fan structure
rib height
radiator heat capacity
numerical simulation
Fluent software
