摘要
以一种用于微波功率模块封装的外壳为例,设计了一种具有弹性结构的引线。通过弹性结构可以释放温度循环中产生的应力,避免失效。应用卡氏第二定律计算了弹性结构的弹性系数。使用HFSS软件建模仿真,讨论了该结构对微波性能的影响。该设计整体考虑了机械设计、热设计和微波设计。
A novel lead design with spring structure was introduced to a power microwave module package. Stress during thermal cycle can be released through the spring structure, which could prevent lead from breaking. The directional spring constant of spring structure was derived by Card＇s second law. Influence of spring structure on insert loss and VSWR were discussed by microwave simulation on HFSS. An optimization was proposed based on the consideration of me-chanical, thermal and microwave design.
出处
《固体电子学研究与进展》
CAS
CSCD
北大核心
2013年第6期566-570,共5页
Research & Progress of SSE
关键词
微波器件外壳
引线设计
弹性系数
microwave device package
lead design
spring constant
