摘要
外壳对于电路而言,在起到机械支撑和环境保护作用的同时,需要将输入/输出信号和电源/地通过封装上的引线实现芯片与外部电子系统的互连。外壳设计与工艺往往影响着被封装系统的微波性能,例如50Ω阻抗的设计、外壳的谐振频率、微波传输线的状态等都是需要在外壳设计与工艺中加以重视的。同时,外壳的可靠性也直接影响到整个封装系统的可靠性,例如外壳的气密可靠性、抗盐雾能力、金属化的强度、引线的抗疲劳弯曲能力等指标决定了外壳的总体可靠性水平。文章以理论分析为基础,结合生产制造的实际情况,以微波高频外壳为例对其设计与制造中应该注意的问题进行了比较详细的阐述。
For the electric circuit, package does the function of mechanic support and protecting the working environment. At the same time, it needs to connect input/output signal and power/ground through the leads to achieve the connection of chips with outside electric system. Package design and techniques will affect microwave performance of the system encapsulated, it need to be pay attention to the package design and techniques that the design of 50 impedance, the frequency resonance of package and the state of microwave transmission line etc. Besides, reliability of the package will affect the whole encapsulation system, for example the reliability of hermetic package, the resistance of salt brume, the strength of metal and the anti-fatigue of leads affect the whole reliability of the package. This article based on theoretical analysis, combined actual condition of production and took microwave package as an example to explain some details which should be paid attention to the design and manufacture.
出处
《电子与封装》
2010年第3期5-8,共4页
Electronics & Packaging
