摘要
介绍了抛光片化学腐蚀抛光原理和HP-602型化学腐蚀抛光机设备用途、结构组成、性能特点,以及解决的关键技术和应用,能自动完成晶片抛光后的碱腐蚀和清洗工艺,是材料行业晶片制备中的关键设备。
The wafer chemical corrosion polishing process is introduced. The applications, structure, characteristics,and the key techniques of HP-602 chemical corrosion polishing equipment are also introduced. The alkali corrosion and cleaning process of the polished wafer can be automatically processed in the equipment. The HP-602 chemical corrosion polishing equipment is the key equipment of material manufacturing.
出处
《电子工业专用设备》
2013年第12期31-35,共5页
Equipment for Electronic Products Manufacturing
关键词
化学腐蚀抛光
循环溢流槽
自动传输机构
PEEK提篮
Chemical corrosion polishing
Cycling and overflowing tank
Automatically transmission mechanism
PEEK basket
