摘要
系统介绍了某型号航天器电缆网上的焊点低应力断裂问题的原因、产生过程及机理分析。通过对电连接器结构、装联工艺和断口特征的分析,故障定位为:电连接器的特殊结构形式导致在尾罩处理过程中导线无法留有应力余量,而在安装应力直接作用下导致焊点断裂。同时,指出了本案例的启示意义。
The cause, forming process and mechanism of a case of lower-stress fracture of solder of the electrical cable of a satellite are systematically presented. Through the analysis on the electrical connector, the process and fracture surface, The fault was located in the special structure of the electrical connector lead the problem of reserving the stress relief of the cable,and the stress acted on the solder, so the solder joints fractured. Also point out its enlightenment.
出处
《电子工艺技术》
2013年第6期345-348,358,370,共6页
Electronics Process Technology
关键词
锡铅共晶焊料
蠕变
低应力
SnPb eutectic solder, creep, low-stress
