摘要
研究了热循环条件下无铅钎料Sn-0.7Cu-0.008Ti/Cu基板形成的通孔插装焊点的导通电阻的变化规律。结果表明:随着热循环次数的增加,焊点电阻增加,高温时的电阻大于低温时的电阻;在相同热循环条件下,随着通孔间隙的增加,焊点电阻降低。热循环过程中焊点电阻增加的原因是由于焊点出现裂纹所致。当热循环次数达到1 000次时,焊点的电阻增加仍不明显,表明通孔插装的Sn-0.7Cu-0.008Ti/Cu焊点有较高的导电可靠性。
The devolvement rules of the on-resistance of Sn-0.7Cu-0.008Ti/Cu through-hole insertion solder joints during the thermal cycles were investigated.The results show that the resistance of the solder joints increases with increasing thermal cycling numbers,and the resistance is greater at high temperature than at low temperature.At the same thermal cycling conditions,the resistance of the solder joints reduces with increasing the soldering clearance.During thermal cycles,the reason for the resistance increase is due to the interfacial cracks between the solder and the substrate.However,when the thermal cycling numbers reach 1 000,the resistance increase of Sn-0.7Cu-0.008Ti/Cu through-hole insertion solder joints still is not significant,which is shown that the solder joints have the superior reliability of conductivities.
出处
《电子工艺技术》
2013年第4期191-193,208,共4页
Electronics Process Technology
基金
广东省产学研项目(项目编号:2008B090500261)
关键词
导通电阻
热循环
通孔焊点
裂纹
On-resistance
Thermal cycling
Through-hole solder
Crack
