摘要
由于大功率LED模组在工作时会产生大量热量并导致LED结温上升,对LED模组寿命产生严重影响,大功率LED模组的热管理问题成为了行业的研究重点。通过对封装和热管技术研究,提出了COB与热管技术结合的热管理设计。通过研究发现,该热管理设计能有效提高散热效率,满足了大功率LED模组散热要求。
High-power LED module produces a lot tff heat when lighting , which causes rise of LED junction temperature anti very strong wol.＇se impact on the lifetime of LED module. The management of higb-puwer LED modnle heat dissipation beeomes res^arch foetus of the industry. This paper based on the study in the technology of encapsulation and heat pipe, puts fbrward a design of management of heat dissipation with combination of COB and heat pipe. The study shows that the design of management of heat dissipation can meet the requirement of high-power LED module heat dissipation witb high efficiency ~ff heat dissipation.
出处
《机电工程技术》
2013年第11期43-45,共3页
Mechanical & Electrical Engineering Technology
关键词
大功率LED模组
COB
热管
热管理
high-power LED module
COB
heat pipe
management of heal dissipation
