摘要
介绍了微电子芯片高热流密度相变冷却技术,包括热管、热虹吸、环路热管、毛细泵吸环路,分析了各自的优缺点,提出LHP和CPL技术是唯一能替代热管技术的先进相变冷却技术,将是今后微电子芯片高热流密度冷却的主要方向。
Phase-change cooling technique was introduced for high heat flux, including heat pipe, thermosyphon, loop heat pipes （LHP）, capillary pumped loops （CPL）, and their merits and shortcomings were analyzed;Only LHP and CPL was put forword can replace heat pipe to realize the advanced phase-change cooling, and they are the main stream of the high heat flux cooling for micro electronic chips.
出处
《流体机械》
CSCD
北大核心
2007年第4期50-55,共6页
Fluid Machinery
基金
国家自然科学基金项目(50436010
50375055)
广东省自然科学基金项目(04105942)
