摘要
阐述了电子器件钎料无铅化的发展历程和研究现状,并通过对国内电子器件的焊点进行EDAX成分分析,研究钎料无铅化的实际应用现状。研究表明:当前国内电子器件所使用的钎料主要还是传统的锡一铅钎料,不过含铅量在逐渐下降。可见国内电子器件钎料无铅化已经起步,然而实现完全无铅化还有一段历程。
The development process and research status of lead-free solder in electronic device were described, and through EDAX composition analysis of solder joints in the domestic electronic device, to study the actual application status of lead-free solder. It was showed that SwPb solder was still used in the current domestic electronic devices as the main solder, but the lead content was decreased year by year. It can clearly be seen, lead free solder have already started in the domestic electronic devices. However, to achieve complete lead free there is still a long way to go.
出处
《理化检验（物理分册）》
CAS
2013年第11期752-755,758,共5页
Physical Testing and Chemical Analysis(Part A:Physical Testing)
基金
福州大学科技发展基金资助项目(2012-XY-2)
关键词
电子器件
无铅钎料
研究现状
electronic devices
lead-free solder
research status
