摘要
采用电化学技术、XRD、DSC等方法研究电流密度对 Ni- W- B合金电沉积、镀层结构和显微硬度的影响 ,结果表明 :沉积电流密度提高 ,Ni- W- B合金电沉积层 W含量增大 ,B含量降低 ,电沉积电流效率降低 .所获得的合金镀层表现为亚稳态纳米晶结构 .在不同电流密度下获得的 Ni- W- B合金电沉积层的显微硬度值接近 ,约为 650 kg/mm2 ,与 Ni-
Effects of current density on the electrodeposition, structure and microhardness of Ni-W-B alloy electrodeposit were studied by means of electrochemical technique, XRD and DSC. The result showed that, by the increase of current density W content in deposit was increased and B content decreased, also deposition current efficiencies decreased. The obtained NiWB alloy electrodeposit was in metastable nanocrystalline structure. The microhardness of the alloy obtained under different current densities were kept almost the same at the value near to 650 kg/mm2, which was obviously higher than that of Ni-W alloy.
出处
《厦门大学学报（自然科学版）》
CAS
CSCD
北大核心
2000年第6期781-785,共5页
Journal of Xiamen University：Natural Science
基金
国家自然科学基金资助项目!(29773039)
