摘要
研究了化学镀 Ni-W-B 合金的工艺及性能。结果表明,在 Ni-B 槽液中加入一定量的钨酸钠溶液,不仅能得到含 W、B 的镀层,而且还能提高镀液的沉积速度;Ni-W-B 合金层的电阻率随钨含量的增加而增大,随镀层厚度的增加而降低。
The technology and properties of elec- troless plating of Ni-W-B alloy have been reported.The results show that the deposits containing W and B are obtained, and the deposition rate of the bath is increased when a certain amount of sodi- um tungstate solution with different W concentration is joined in the Ni-B bath. The resistivity of Ni-W-B alloy film increases directly with an increasing W content,but decreases gradually with an increasing deposit thickness.
出处
《功能材料》
EI
CAS
CSCD
1992年第3期148-152,共5页
Journal of Functional Materials
关键词
化学镀
Ni-W-B合金
非晶质
电阻膜
electroless plating Ni-W-B alloy amorphous electrical resist- ance film
