期刊文献+

InP上Al膜的阳极氧化及其特性研究

STUDY OF THE ANODIZATION OF Al FILM ON InP SUBSTRATE AND ITS PROPERTIES
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摘要 本文报道了半导体InP上Al膜阳极氧化的研究,并用AES,V-V,DLTS和椭圆仪等测试方法研究了氧化膜的稳定性、电学特性、组分的纵向分布以及Al_2O_3/InP的界面特性,研究结果表明,阳极氧化Al_2O_3的介电常数为11~12,Al_2O_3/InP界面存在一个能量上连续分布的电子陷阱,DLTS峰值对应的能级位置约在E_c-E_c=0.5eV,其俘获截面约为10^(-15)cm^2,Al_2O_3/InP的界面态密度为10^(11)cm^(-2)eV^(-1)。阳极氧化Al_2O_3的稳定性要比InP自身氧化物好得多,更适于用作器件的钝化保护和扩散掩蔽膜。 The anodization of Al film on InP substrate and the properties of anodic Al2O3/lnP have been investigated by AES, DLTS, I-V, C-V and ellipsometer. The results show that the anodic oxide Al2O3 has the permitivity of 11-12 and the resistivity of 1.3×10^(13) ohm-cm. Interface state density at Al2O3/InP is about 10^(11)cm-2·eV-1. DLTS reveals that there is continuously-distributed interface electron traps at Al2O3/lnP interface. Anodic oxide Al2O3 exhibits good stability and electrical properties and could be used for passivation, diffusion mask and gate insulator etc.
出处 《电子科学学刊》 CSCD 1991年第6期611-617,共7页
关键词 半导体界面 阳极氧化 介质薄膜 Semiconductor interface Anodization Dielectric thin film
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参考文献1

  • 1Y. Hirayama,H. M. Park,F. Koshiga,T. Sugano. Plasma anodization of evaporated Al-InP systems[J] 1982,Journal of Electronic Materials(6):1011~1022

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