摘要
利用高精度X射线检测设备分别对用Sn37Pb焊膏和Sn3．0Ag0．5Cu焊膏组装的高密度LED灯板进行焊后和老化后的微空洞检测，观察了焊点的微空洞缺陷，并计算微空洞尺寸。结果表明：老化前微空洞面积与焊点面积比在10％～25％的，Sn3．0Ag0．5Cu焊点中约含25．5％，略大于Sn37Pb焊点的23．5％，且明显小于Sn3．0Ag0．5Cu焊点老化后的31．4％。两种焊点老化前后微空洞所占面积比都在〈25％的合格范围内，但Sn3．0Ag0．5Cu焊点更易形成微空洞。
X-ray detection facility was employed to investigate micro voids of the Sn37Pb and Sn3.0Ag0.5Cu solder joints in high density LED packages under as-reflowed and isothermal aged conditions. The micro voids inside the joints were observed, the sizes of which were measured. The results show that the area ratio （micro voids area/solder joints area） between 10%-25% of the micro voids inside the Sn3.0Ag0.5Cu solder joints is about 25.5%, which is slightly higher than the 23.5% inside the Sn37Pb solder joints, and is obviously less than the 31.4% after isothermal aging. The area ratios of the micro voids inside the Sn3.0Ag0.5Cu and Sn37Pb solder joints are all within the acceptable range （〈25%）, but the Sn3.0Ag0.5 Cu solder joints are easier to form the micro voids after reflowing.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2012年第1期64-67,共4页
Electronic Components And Materials
