摘要
对显著影响平板微小器件注塑成型的翘曲现象进行了研究。为了减少翘曲量,以带十字微沟槽的微流控芯片的基片为研究对象,研究了注塑工艺涉及的工艺参数。从注塑残余应力角度分析了翘曲变形的产生机理与演化过程。然后,以数值仿真和工艺实验为手段,建立了平板微小器件翘曲的测量方法。设计加工了基于硅型芯的注塑模具,以翘曲测量方法为基础,利用正交试验获得了最优注塑工艺参数。最后,通过极差分析法定量分析工艺参数对翘曲的影响。实验显示,通过工艺优化获得的最小翘曲量为141μm,工艺参数对翘曲的影响由大到小依次为:保压时间、模具温度、保压压力、熔体温度、冷却时间。该研究成果为平板微小器件注塑工艺提供了参考依据。
This paper explored the warpage which has significant influence on the quality of inject molding for flat micro-mini parts.To control the warpage to an acceptable level,the warpage of a microfluidics plate with a cross-shaped microchannel was researched and the effect of processing parameters on the warpage was considered in detail.First,the generation mechanism and evolution course of the warpage from injection molding was analyzed based on residual stress.Then,the warpage measurement method was established according to simulation technologies and experimental methods.A Si-core based injection mold was designed and fabricated and the optimum processing parameters were obtained with orthogonal experimental method to achieve the minimum warpage.Finally,the quantitative correlations between the warpage and the processing parameters were investigated by extreme difference analysis.Experimental results indicate that the minimum warpage is 141 μm after optimum processing and the sequence of from strong correlation to weak correlation is：holding time,mold temperature,holding pressure,melting temperature and cooling time.The result is helpful to optimize the injection processing of polymer flat micro-mini parts.
出处
《光学精密工程》
EI
CAS
CSCD
北大核心
2013年第7期1825-1830,共6页
Optics and Precision Engineering
基金
国家自然科学基金资助项目(No.91023046,No.51075056,No.91023017)
国家863高技术研究发展计划资助项目(No.2012AA040406)
中央高校基本科研业务费专项资金资助项目(No.DUT12ZD212)
关键词
注塑成型
平板微小器件
翘曲
极差分析法
injection molding
flat micro-mini part
warpage
extreme difference analysis
