摘要
凸点的制作方法有很多种,但是电镀法可以制作各类凸点,它对芯片的I/O数、焊区尺寸大小及凸点节距均没有限制,且适于大批量生产。介绍了垂直剪切镀技术的基本原理,根据微电子圆片级封装在硅圆片上制作凸点的需要,设计研制了一套设备。经过优化设计,解决了剪切镀关键技术问题并满足了工艺要求,取得了良好效果。
There are many ways of making bump,but electroplating method can create all kinds of bump,there is no limit for I/O number,soldered area and bump pitch on the chip,and is suitable for mass production.Introduce the basic principle of vertical shear plating technology.A set of equipment was developed according to the request of making bumps on a silicon wafer in microelectronics wafer level packaging production.Solved the key technical problems of shear plating and met the process requirements,and achieved good results by design optimization.
出处
《电子工艺技术》
2013年第3期178-180,共3页
Electronics Process Technology
基金
国际科技合作项目(项目编号:2008DFA10530)
