摘要
回顾了低成本制备芯片上焊料凸点的方法,即化学镀镍制备凸点下金属层、模版印刷焊料,最后回流形成焊料凸点,并综述了该方法的最新研究进展。
In this paper, a low cost flip chip interconnection is introduced, which electrolessNi as the under bump metallurgy (UBM), deposits solder paste using stencil printing, and reflowsthe paste to form solder bumps. The development and recent research are also reviewed .
出处
《半导体技术》
CAS
CSCD
北大核心
2002年第3期31-36,共6页
Semiconductor Technology
