摘要
直接敷铜Ａｌ２Ｏ３基板已被广泛应用于大功率场合．本文通过Ｃｕ箔表面预氧化生成Ｃｕ２Ｏ的方法引入氧，１０７０℃在Ｃｕ箱和Ａｌ２Ｏ３基板界面上所产生的Ｃｕ－Ｃｕ２Ｏ共晶液体促进了二者的牢固结合．流动氮气氛下保温１ｈ，观察到了明显的界面产物层．ＳＥＭ和ＸＲＤ的分析表明，界面产物相为ＣｕＡｌＯ２．
Direct copper-bonded alumina substrates were widely used in large-power applications. Cu-Cu2O eutectic bonding of copper to Al2O3 was investigated in this paper. Oxygen was introduced by pre-oxidizing copper foil and it was shown that Cu-Cu2O eutectic liquid promoted the bonding between copper and Al2O3 greatly. Chemical reaction happened at the solid-liquid interface and led to the formation of the binary oxide CuAlO2, which can be observed when the specimen was prepared at 1070℃ for 60min.
出处
《无机材料学报》
SCIE
EI
CAS
CSCD
北大核心
2000年第5期935-938,共4页
Journal of Inorganic Materials
