摘要
鉴于SVG逆变桥IGBT的过热故障,进行IGBT热力学故障发生机理分析,进行故障状态下SVG三维稳态温度场建模分析。为确定ANSYS workbench热力学仿真的边界条件,通过Fourier定律和能量守恒定律分析,推导模拟导热微分方程的边界条件表达式;给出IGBT不同温度条件下热损耗及其与温度间的变化规律。基于所建立Solidworks空间模型进行SVG三维温度场模拟。仿真结果与IGBT温耗曲线及热成像仪实测结果相印证,可为模拟IGBT过热故障瞬间的温度场变化奠定理论分析基础。
In view of the IGBT overheating failure of the SVG inverter bridge, the thermodynamic failure mechanisms of IGBT was analyzed. To determine the boundary conditions of ANSYS workbench thermodynamic simulation, by Fourier＇s law and the law of conservation, the boundary conditions expression of heat conduction equation was derived; IGBT＇s heat loss and its temperature variation was given under different temperature conditions. The simulation results were corresponded to IGBT temperature consumption curve and thermal imaging＇s results. The simulation lays the theoretical basis for IGBT instantaneous temperature changes.
出处
《电源学报》
CSCD
2013年第3期37-41,共5页
Journal of Power Supply
基金
国家自然科学基金项目(50877016
50877017)
中国博士后基金资助项目(20100471063
20090238550877016)
