摘要
倒装芯片技术正得到广泛应用 ,凸点形成是其工艺过程的关键。介绍了现有的凸点制作方法 ,包括蒸发沉积、印刷、电镀、微球法、黏点转移法、SB2 -Jet法、金属液滴喷射法等。每种方法都各有其优缺点 ,适用于不同的工艺要求。可以看到要使倒装芯片技术得到更广泛的应用 。
Today flip chip is becoming more important and attractive. Key point of the flip chip is the existence of bumps.This is an overview of the existing bump fabrication technology.Many bumping technologies have been developed.The major bumping methods,such as evaporation,plating,electroplating,Micro-ball,Tachy dots TM ,SB 2-Jet,metal ink jet etc ,are all introduced.We can see that every method has its merits as well as demerits. The increased performance, small size and high reliability of flip chip devices alone will not make them accessible for future products and markets. To achieve adequate economy and performance, the selection of a suitable bumping technology becomes very important.
出处
《电子工艺技术》
2003年第2期62-66,共5页
Electronics Process Technology
