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大功率LED强化散热技术进展 被引量:6

Technology Progress on High-Power LED Strengthen Heat Dissipation
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摘要 从封装材料与技术、散热基板、热沉结构和壳体设计等四个方面,综述了强化散热技术最新进展。在现有材料的基础上,改良散热结构的研究较为丰富,是强化散热的关键点。从能源综合管理的角度,提出兼顾经济性、可靠性和实效性的散热设计思想,提出复合换热方式以及非稳态换热技术在LED散热上的应用有待研究。 The latest advances were reviewed on strengthen heat dissipation from four aspects including the packaging materials and technology, the cooling substrate, the heat sink structure and shell design. On the basis of existing materials, improved heat dissipation structure is the key point for strengthening heat dissipation, and the research on heat sink structure is more abundant. From the comprehensive energy management, the LED heat dissipation design idea makes a balance between the economic, reliability and effectiveness. Compound heat exchange pattern and unsteady heat transfer technology in the application of LED heat dissipation has the room for improvement.
出处 《轻工机械》 CAS 2013年第2期107-112,共6页 Light Industry Machinery
关键词 大功率LED 强化散热 封装 热沉 能源综合管理 high power light-emitting diode strengthen heat dissipation packaging heat sink energy comprehensive management
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  • 1阎军,孙兴盛,王乜,王舒,毛火华,刘书田.半导体照明灯具典型散热结构分析与优化[J].固体力学学报,2010,31(S1):285-293. 被引量:9
  • 2廖志凌,阮新波.半导体照明工程的现状与发展趋势[J].电工技术学报,2006,21(9):106-111. 被引量:113
  • 3方志烈.热管散热技术在半导体照明光源上的应用[J].真空电子技术,2006,19(5):69-70. 被引量:8
  • 4NARENDRAN N, GUY M. Life of LED-based white light sources [ J ]. IEEEJ Disp Tech, 2005,1 ( 1 ) : 167-171.
  • 5KIM L, CHOI J, JANG S H, et al. Thermal analysis of LED array system with heat pipe [J]. Thermo chemical Aeta, 2007(455) :21-25.
  • 6SHIN M W. Thermal design of high-power LED package and system [J ]. Proceeding of SHE, 2006,6355: 9-21.
  • 7SHABANYY.传热学:电力电子器件热管理[M].北京:机械工业出版社,2013.
  • 8王超.电子元撂件自然对流散热器的设计探讨[C]//2005FLUENT中国用户大会论文集.上海:飞昂软件技术(上海)有限公司,2005:344-348.
  • 9BING Luiyi. On thermal structure optimization of a power LED lighting[J]. Procedia Engineering,2012,29:2765 - 2769.
  • 10FU H K,WANG C P,CHIANG H C,et al. Evaluation of temperature distribution of LED module[J]. Microelectronics Reliability,2013,53 (4) :554 -559.

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