摘要
随着LED芯片输入功率的提高,带来了大的发热量及要求高的出光效率,给LED的封装技术提出了更新更高的要求,使得功率型LED的封装技术成为近年来的研究热点。首先介绍了几种主要的功率型LED封装结构,对功率型LED封装过程的关键技术,如荧光粉涂覆技术、散热技术、取光技术、静电防护技术等及未来发展方向进行了描述。指出功率型LED封装应选用新的封装材料,采用新的工艺和新的封装理念来提高LED的性能和光效,延长使用寿命,以推进LED固体光源的应用。
Along with enhancement of the LED inputpower,high heat and light efficiency were requested. The power-LED package technology has became research hotspot recently. The article firgt introduced several main power-LED package structures, summarized key technologies, such as phosphor coating technique, heat dissipated technique, luminous technique, electrostratic protection technique, and future development direction. It is pointed out that the power-LED package should select the new package material, new process and new package idea to enhance the LED performance and light effect and to delay the lift time, so the application of LED＇s lightsource can be advanced.
出处
《液晶与显示》
CAS
CSCD
北大核心
2008年第4期508-513,共6页
Chinese Journal of Liquid Crystals and Displays
基金
邵阳职业技术学院2008年重点科研资助项目(NoSZ2008006)
