摘要
由于光电转换效率较低,产生的多余热已成为提升单位体积下大功率LED(HPLED)灯光输出量的主要瓶颈,使有效减少HPLED灯热流回路上各界面接触热阻成为重要课题。研究了不同的非金属基导热界面材料在不同环境温度条件下,应用于HPLED灯具模型中的第二界面处时对灯具散热情况的影响。结果表明,具有相变特征的非金属基导热界面材料,在其相变转化点位置之上的某一特定临界点后的热传导性能优于导热系数相对更高的非金属石墨基的界面材料。第二界面材料之间的接触热阻对发挥其导热能力有重要影响。
Because of low photoelectric conversion efficiency, HPLED produce excrescent quantity of heat becomes the main bottleneck of increasing light output per volume. It is important to reduce the thermal contact resistance of all interfaces in the thermal circuit of HPLED lamp. The effect of nonmetallic thermal conductive interface materials on the heat dissipation of HPLED lamp model was studied at the second interface under different temperatures. Experiment results show that the nonmetallic thermal conductive interface materials with phase-change character has a special critical point that is prior to the nonmetallic graphite interface material which is with higher thermal conductive coefficient. And the thermal contact resistance between the second interface materials can greatly affect thermal conductive capability of these materials.
出处
《半导体技术》
CAS
CSCD
北大核心
2009年第2期161-164,共4页
Semiconductor Technology
