摘要
印制电路板的布线设计是否符合SMT工艺技术和工艺设备的要求,对印制板组件装联质量的直通率有着直接的非常重要的影响。PCB布线设计满足制造要求是保证表面组装质量的关键要素之一。对SMT印制电路板设计中的常见问题进行了举例说明并给出了正确的解决方法,同时给出了消除不良设计和实现可制造性设计的8项措施。
Printed circuit board wiring design whether they conform to the requirements of SMT process and equipment, has a direct important effect on printed circuit board assembly quality and yield. PCB wiring design which meet manufacturing requirements is one of the key factors to ensure assembly quality. Introduce the common problems in SMT printed circuit board design and give the solutions, at the same time give 8 measures for eliminating poor design and achieving design for manufacturability.
出处
《电子工艺技术》
2013年第1期40-43,共4页
Electronics Process Technology
关键词
PCB布线设计
表面组装质量
可制造性设计
Printed circuit board wiring design
SMT assembly quality
Design for manufacturability
