摘要
设计制作了一块由不同封装形式和材料参数的芯片集成的SMT电路板组件。根据各芯片和PCB板的参数建立了有限元模型,通过有限元仿真对该组件进行了不同约束条件下的模态分析及瞬态冲击动态响应分析,得到了该组件的前五阶固有频率(四角约束条件下分别为862.07,1144.70,1445.20,1915.50和1941.70Hz)及相应频率下的模态参数。并通过实验和仿真结果的对比验证了所建立的有限元模型基本正确,该模型可作为组件疲劳寿命估计和结构优化的基础。提出了芯片布局优化及提高可靠性的建议。
A SMT PCB assembly integrated by chips with different packaging forms and material parameters was designed and produced.A finite element model was established according to the chips and PCB parameters.Through the modal analyses and transient shock dynamic response analyses on the SMT PCB assembly,which were carried out in different constraint conditions,some modal parameters of the SMT PCB assembly were obtained including the first 5-order inherent frequency （862.07,1 144.70,1 445.20,1 915.50,1 941.70 Hz under four corners constraint condition） and the modal parameters under the corresponding frequency.In this process,both the finite element simulation method and the modal experimental method were employed.Results show that the finite element model is proved to be correct through the comparison of the experimental and simulation calculation,which is also helpful for the future fatigue life estimation and structural optimization.Meanwhile,it also can help to optimize the chip layout and improve its reliability.In the end,some suggestions to optimize the chip layout and improve its reliability are put forward.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2010年第12期56-58,共3页
Electronic Components And Materials
基金
江苏省自然科学基金资助项目(No.BK2009662)
江苏省高校自然科学重大基础研究资助项目(No.09KJA460001)
