摘要
在微电子封装领域纳米导电胶越来越引人注目,因为与传统导电胶相比纳米导电胶具有特殊的电性能和力学性能。目前纳米导电胶的研究涉及采用纳米颗粒、纳米线和碳纳米管等作为导电填料制备高性能导电胶,以及采用自组装单分子膜(SAMs)技术改性各项异性导电胶互连中金属填料和金属焊盘的界面来提高互连接头电性能。概述了近年来纳米导电胶的研究进展。
Nanoconductive adhesives have been attracting more and more interest in microelectronic packaging field due to their unique electrical and mechanical properties compared to conventional conductive adhesives. There has been extensive research on electrical conductive adhesives with nanotechnologies, such as introducing nanoparticles, nanowires, carbon hang tubes or graphene into conductive filters and introducing selfassembled molecular wires （SAM） into the interface between metal fillers and metalfinished bond pad of ACAs. provide a comprehensive review of most recent advances in nanoconductive adhesives.
出处
《电子工艺技术》
2013年第1期1-5,21,共6页
Electronics Process Technology
基金
中欧联合科技合作项目(项目编号:No.1110)
欧盟第7框架项目(项目编号:PIRSES-GA-2010-269113)
关键词
各向同性导电性胶
各向异性导电胶
纳米填料
自组装单分子膜
Isotropic conductive adhesives
Anisotropic conductive adhesives
Nano-fillers
Self-assembled monolayers
