摘要
综述了导电胶的导电机理。导电胶作为无铅焊焊料的替代品,相关研究已受到普遍的重视,但对导电胶导电机理研究的不足在一定程度上制约了其应用与发展。导电胶的导电机理相当复杂,通常可以分为导电通路如何形成与材料形成导电通路后如何导电这两个方面的内容来研究。对此,人们提出了许多阐述导电胶导电机理的理论和模型。本文详细介绍了渗流理论、界面热力学理论、有效介质理论、量子力学隧道效应理论等几种具有代表性的导电理论,对其适应范围、优缺点等进行了评述。
Abstract： The conducting mechanism of conductive adhesive is reviewed. As a substitute of lead-free solder, conductive adhesives have attracted a great deal of scientific interests. But the study on the mechanism of electrical conduction is insufficient, which restricts the developments and applications of these materials mostly. The conduction mechanism of conductive adhesive is complex which includes the formation of the conductive path and the electron transport mechanism in these paths. There are many kinds of theories and models proposed to expatiate the conducting mechanism of conductive adhesive. The percolation theory, inteffacial thermodynamics theory, effective medium theory and quantum mechanical tunneling conduction theory are introduced in detail and the applicability of these conduction mechanisms are also discussed.
出处
《高分子通报》
CAS
CSCD
北大核心
2009年第7期53-60,共8页
Polymer Bulletin
基金
国家高技术研究发展计划(863计划)探索基金项目(2003AA84ts04)
关键词
导电机理
渗流理论
界面热力学理论
隧道效应
有效介质理论
Conduction mechanism
Percolation theory
Interfacial thermodynamics theory
Tunneling effect
Effective medium theory
