摘要
研究了等温时效对 ＳｎＡｇ／Ｃｕ表面贴装焊点微结构， Ｓｎ－Ｃｕ金属间化合物生长及其剪切强度的影响，并与常用的６２Ｓｎ３６Ｐｂ２Ａｇ／Ｃｕ焊点进行了比较，结果表明，在时效过程中， ＳｎＡｇ钎料以较小的反应速率与 Ｃｕ发生反应 ＳｎＡｇ焊点显示了较强的剪切强度并且其受时效的影响较
The effect of aging on the microstructure and shear strength of SnAg/Cu surface mount solder joint was investigated with comparison to 62Sn36Pb2Ag/Cu. It was found that the reaction rate between SnAg and Cu is smaller compared with SnPbAg and the shear strength of SnAg solder joint is higher and not so sensitive to the aging process.
出处
《金属学报》
SCIE
EI
CAS
CSCD
北大核心
2000年第7期697-702,共6页
Acta Metallurgica Sinica
