摘要
研究Cu基体和Sn-3.5Ag无铅钎料在钎焊和时效处理时金属间化合物的生长问题。结果表明,时效温度为70、125和170℃时,钎焊后会出现层状的扇贝形金属间化合物,其厚度与时效处理时间的平方根呈线性关系。金属间化合物层的生长激活能为75.15 k J/mol,Cu6Sn5层的生长激活能为58.58 k J/mol。
The growth of Sn-Ag brazing intermetallic compound during welding and aging treatment was studied. The results show that scallop shape intermetallic compound layer can be obtained by brazing at 70, 125 and 170 ℃, which is showing linear relationship between the thickness of the compound layer and aging processing time＇s square root. The growth activation energy of intermetallic compound layer is 75.15 kJ/mol, while the Cu6Sn5 layer is 58.58 kJ/mol.
出处
《铸造技术》
CAS
北大核心
2015年第4期1012-1015,共4页
Foundry Technology
基金
2013年度广西高校科学技术研究项目(2013YB338)
