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服役条件对内生颗粒增强复合钎料性能的影响 被引量：3

Effects of service conditions on properties of in-situ particle-reinforced composite solder joint
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摘要 内生法制备复合钎料被认为是提高无铅钎料性能的有效途径.为了提高基体钎料的综合性能,试验采用内生均匀分布的Cu6Sn5颗粒作为增强相,以Sn-3.5Ag共晶钎料作为基体,制成内生Cu6Sn5颗粒增强的SnAg基复合钎料.研究了服役条件下内生Cu6Sn5颗粒增强复合钎料的显微组织和抗剪强度,对复合钎料钎焊接头的断裂方式及增强相的作用进行了分析.结果表明,随着再流及时效的进行,复合钎料内部Cu6Sn5颗粒的形貌及尺寸发生变化,进而影响复合钎料钎焊接头的抗剪强度.复合钎料钎焊接头的变形方式主要受滑移带控制,内生Cu6Sn5颗粒增强相可以起到阻碍滑移带扩展的作用. In-situ particle-reinforced composite solder was considered as an effective method to enhance the properties of lead-free solders.In-situ Cu6Sn5 particles were added into the eutectic Sn-3.5Ag solder to form in-situ metal particles enhanced SnAg-based composite solder.The microstructure and mechanical properties of the composite solder joint during reflow and isothermal aging were investigated,and the fracture mode of composite solder joint and the role of in-situ Cu6Sn5 particles were analyzed.Experimental results show that the microstructure and dimensions of in-situ Cu6Sn5 particles in composite solder matrix have changed during reflow and isothermal aging.So the shear strengths of composite solder joints have influenced by the sizes of in-situ Cu6Sn5 particles.Besides,the deformation of composite solder joint is dominated by shear bonding mode,and the in-situ Cu6Sn5 reinforced particles can retard the fracture path of shear bonds.
作者 邰枫 郭福 马立民 韩孟婷
机构地区 北京工业大学材料科学与工程学院
出处 《焊接学报》 EI CAS CSCD 北大核心 2010年第4期81-84,共4页 Transactions of The China Welding Institution
基金 北京市科技新星计划基金资助项目(2004B03)
关键词 内生Cu6Sn5颗粒 复合钎料 再流 时效 抗剪强度 in-situ Cu6Sn5 particle composite solder reflow aging shear strength
分类号 TG454 [金属学及工艺—焊接]
  • 相关文献

参考文献11

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共引文献86

同被引文献70

  • 1李擘,史耀武,夏志东,雷永平,郭福.添加微量稀土元素的SnAgCu无铅钎料的研究[J].电子工艺技术,2004,25(5):193-198. 被引量：5
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  • 3Jun SHEN Yongchang LIU Dongjiang WANG Houxiu GAO.Nano ZrO_(2) Particulate-reinforced Lead-Free Solder Composite[J].Journal of Materials Science & Technology,2006,22(4):529-532. 被引量：1
  • 4郝虎,田君,史耀武,雷永平,夏志东.SnAgCuY系稀土无铅钎料显微组织与性能研究[J].稀有金属材料与工程,2006,35(A02):121-123. 被引量：27
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引证文献3

二级引证文献10

焊接学报
2010年 第4期

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