摘要
借用六面顶液压机在高温高压条件,以粒度为5μm的金刚石微粉为原材料,采用Co作为粘结剂,利用不同的工艺参数(温度、压力、时间)合成得到PCD拉丝模坯,分别测得不同工艺参数下PCD拉丝模坯试样的显微硬度和磨耗比,并通过对试样进行的显微形貌和微观结构观察,分析了PCD拉丝模坯试样出现显微硬度和磨耗比差异的原因。结果表明:PCD拉丝模坯的磨耗比、维氏硬度等均随着烧结时间的增长先增加后降低,在烧结时间为180s时达到最大,这是由于烧结时间过短,其微观组织孔隙较大,烧结时间过长,金刚石石墨化严重;PCD拉丝模坯的磨耗比、维氏硬度等均随着烧结温度的升高先变大后减小,在烧结温度为1 550℃时达到最大,烧结温度过低,金刚石晶粒棱角分明,晶粒间隙较大,而烧结温度过高,晶粒发生异常生长。
The microhardness and abrasion ratio of the polycrystalline diamond（PCD） die blanks, which were prepared with particle size for 5μm diamond fine powder as raw materials, Co as adhesive by the cubic synthetic diamond press in different synthetic process parameters, were measured. The results show that the abrasive ratio and vickers-hardness of PCD die blanks increase firstly, then decrease with the increase of sintering time, and reach the maximum at the sintering time for 180 s, this is because when sintering time is too short, its microstructure porosity is larger, and when sintering time is too long, the diamond graphitization will be serious. And the abrasive ratio and vickers-hardness of PCD die blanks will also increase firstly, then decrease with the increase of sintering temperature, and reach the maximum at the sintering temperature for 1 550℃, this is because when sintering temperature is too low, the diamond grain become the sharp-featured and the grain clearance is bigger, and when the sintering temperature is exorbitant, the grain will grow a- nornaly.
出处
《武汉理工大学学报》
CAS
CSCD
北大核心
2013年第1期17-21,81,共6页
Journal of Wuhan University of Technology
基金
湖北省教育厅重点科研基金(2008B23)
