摘要
清洗是CBGA封装中的一道重要工序,它对电子产品的质量和可靠性起着极为重要的作用。对于CBGA电子产品,植球后都需要进行严格有效的清洗,以去除残留助焊剂和污染物。主要介绍了CBGA植球回流焊后助焊剂清洗的基本原理,分析了清洗温度和清洗剂浓度对陶瓷基板上残留的助焊剂清洗效果的影响,并对其影响机理进行了深入剖析。结果表明,清洗温度为55℃～65℃、清洗剂浓度为8%~12%时,残留助焊剂的清洗效果最佳。
Cleaning is an important process during CBGA package assembly,and it impacts the quality and reliability of electronic products.Strict and effective cleaning for CBGA of electronic product must be done to remove flux residue and pollutant after ball mounting in CBGA package.The basic principle of flux residues cleaning after ball mounting in CBGA package was introduced.The effect of cleaning temperature and concentration of solution on flux residues cleaning was investigated,and the mechanism was deeply analysised.The results indicated that the effect of flux residues cleaning was best in terms of reasonable cleaning temperature（55℃~65℃） and concentration（8%~12%）.
出处
《电子与封装》
2012年第12期18-20,共3页
Electronics & Packaging
关键词
CBGA
清洗温度
清洗浓度
水基清洗剂
CBGA
cleaning temperature
concentration of solution
water-based cleaner
