摘要
采用粉末冶金法制备SiC体积分数分别为20%、35%、50%的SiCp/Cu复合材料,并采用扫描电镜、热膨胀仪、热分析仪、洛氏硬度计等对其显微组织、热物理性能和力学性能进行表征。结果表明,随着SiCP含量升高,偏聚现象趋于明显,SiCp/Cu复合材料热导率减小,分别为167、145、130W/m·K,SiCp/Cu复合材料热膨胀系数分别为10.2×10-6、8.6×10-6、9.6×10-6 K-1,呈先减小后增大趋势;在SiCp/Cu复合材料中,当SiC体积分数小于35%时,其硬度值变化取决于SiCp含量,当SiC体积分数大于35%时,其硬度值取决于致密度。
SiCp/Cu composites with a volume fraction of 20%,35%,and 50% were prepared by powder metallurgy,and the microstructure,thermal physical properties and hardness of the composites were investigated by SEM,thermal dilatometer,thermal detector and Rockwell apparatus.It is found that with the content of SiC increasing,segregation becomes worse,and thermal conductivity of 20%,35%,50% SiCp/Cu composites are 167,145,130 W/m·K,respectively.Thermal expansion coefficients of the composites are 10.2×10^-6,8.6×10^-6,9.6×10^-6 K-1,respectively,demonstrating the tendency of first decreasing and then increasing.When SiC volume fraction of SiCp/Cu composite is less than 35%,the hardness of the composites depends on SiC content;while SiC volume fraction is greater than 35%,the hardness depends on density of the composites.
出处
《武汉科技大学学报》
CAS
2013年第1期41-44,共4页
Journal of Wuhan University of Science and Technology
基金
国家自然科学基金资助项目(51174028)
北京市自然科学基金资助项目(2102029)
关键词
SICP
CU复合材料
热膨胀系数
热导率
硬度
SiCp/Cu composites
thermal expansion coefficient
thermal conductivity
hardness
