摘要
分析了低温密封焊的工艺难点,通过改变腔体耦合结构及工艺实验,实现了微波产品高气密性快速低温焊接。从焊料、气密性两方面进行工艺难点分析并进行工艺实验及可靠性实验研究。通过调整腔体的耦合结构,选择In-3Ag焊丝和GD401硅橡胶,烙铁温度设置为320～330℃,热台温度设置为110～120℃时,能实现微波产品高气密性、快速低温焊接。解决了助焊剂污染问题,满足可靠性实验要求。除以上主要影响因素,水汽含量也是需要考虑的。为进一步研究低温密封焊接提供重要依据,同时此技术可借鉴应用于产品的批量生产。
The technical difficulties of the low-temperature hermetic soldering were analyzed and the high speed, low-temperature hermetic soldering was achieve by changing the coupling structure of the box and the technical experimentation. The solder and airproof soldering were analyzed and researched by technical experimentation. The high speed, low-temperature hermetic soldering was realized by changing the coupling structure of the box, choosing the In-3Ag welding rod and GD401 silica gel, setting the brand iron temperature 110 -120 ℃ and hot table-board temperature 320 -330 ℃. The pollution of the fluxing agent was solved, and the requisition of the reliable experimentation was satisfied. The water vapor content was necessary to consider excepting the above-mentioned influence factors. It provides the vital basis of the further the low-temperature hermetic soldering researching, the technology is applying to mass production.
出处
《半导体技术》
CAS
CSCD
北大核心
2013年第1期65-68,共4页
Semiconductor Technology
关键词
低温密封
工艺
微波产品
焊接
助焊剂
low-temperature hermetic
technology
microwave products
soldering
fluxing agent
