摘要
针对柔性基板易于弯曲、卷曲和扭转等特点影响BGA组装的问题,通过对柔性基板上BGA组装的工艺技术及可靠性保障技术等研究,确定了局部增厚提高可靠性,通过丝印模板和托板技术的应用,解决组装的平整性,实现了柔性基板上BGA器件组装技术。
The flexible substrate is easy to bend,Curl and twist,which can affect the BGA assembling.Based on the flexible substrate BGA assembly technology and reliability technology research,identified a localized thickening to improve reliability,solved the coplanarity problem during assembly by screen printing technology and the supporting technology,and complete the BGA assembly on flexible substrate.
出处
《电子工艺技术》
2012年第6期344-346,368,共4页
Electronics Process Technology
