摘要
印制电路板的散热性能是影响电子产品可靠性的重要因素,而电路板的表面温度分布很难通过测量获得。通过有限元分析方法,模拟了印制电路板的温度场分布,并对元器件在嵌入不同厚度铝基导热层基板上稳定工作时的散热过程进行了分析。分析结果表明在PCB内部嵌入不同厚度铝基导热层可以有效地降低元器件失效率,增加产品可靠性,该结果可以为PCB制造过程中基板的选择提供指导。
Heat dissipation capability of PCB is a significant factor which affects the reliability of electronic products. However it is difficult to obtain the surface temperature distribution of PCB by direct measurement. In this paper, temperature field distribution of PCB was analyzed by finite element analysis. Furthermore the heat dissipation process of PCB embeds different thickness of aluminum-layer as heat conduction layer was also analyzed. The results show that embedding different thickness of metal aluminum in PCB substrate can reduce the failure rate of components and increase the reliability of products effectively. These results can provide guidance for PCB substrate choice through manufacture.
出处
《印制电路信息》
2012年第4期60-63,共4页
Printed Circuit Information
