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电场时效对LY12铝合金微变形行为的影响 被引量:3

Influence of Aging in Electric Field on Microplastic Deformation Behavior of LY12 Al Alloy
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摘要 研究了电场时效处理中电场强度对LY12铝合金的微屈服强度和微变形行为的影响,也研究了直流电场时效和脉冲电场时效对合金微变形行为的影响。结果表明,适当的电场时效可以使合金的微屈服强度明显提高,优选出最佳的电场时效工艺参数是:E=2kV/cm,190℃/10h。 The influence of electric field intensity during aging in an electric field on the microyield strength and microplastic deformation behavior of LY12 aluminum alloy was studied Moreover, the microplastic deformation behaviors of the alloy after aging in a direct current electric field and pulse electric field,were studied respectively The results show that the microyield strength of the alloy is obviously improved by an appropriate procedure of aging in an electric field and the optimum processing parameter is E=2kV/cm,190℃/10h 
出处 《材料工程》 EI CAS CSCD 北大核心 2003年第5期15-18,共4页 Journal of Materials Engineering
关键词 LY12铝合金 电场时效 微屈服强度 微变形行为 LY12 Al alloy aging in electric field microyield strength microp-plastic deformation behavior
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  • 1蔡安源,杜树芳译. 精密机械制造与仪表制造中金属和合金的尺寸稳定性[M].北京:科学出版社,1981.
  • 2杨飞龙.金属材料的尺寸稳定性[J].河南科技,1997,16(11):16-16. 被引量:3
  • 3Han-Cheng, New-Jin, J C Huang. Precipitation Behaviours in Al-Cu-Mg and 2024 Aluminum Alloy[J].Metallurgical and Ma terials Transaction A,1996,27A:2479-2494.
  • 4武恭,姚良均, 等. 铝及铝合金材料手册[M]. 北京:科学出版社,1993.67-68.
  • 5王秀芳,等. 一种提高了LY12铝合金微塑性变形抗力的新工艺[A]. 见:2000中国材料研讨会论文集[C].944-947.
  • 6Wang Xiufang,Sun Dongli,Wu Gaohui,Wang Meiling. Technology of Aging in an Electric Field of Improving the Resistance to Micro-plastic Deformation of 2024 Alloy[J]. Trans. Nonferrous Met. Soc. China,2002,12(2):283.
  • 7H Conrad,W D Cao. Effect of an Electric Field on the Super-plastic of 7475Al[J]. Scripta Metallusgica,1989,23(5):696-699.
  • 8W D Cao,X P Lu. Superplastic Deformation Behavior of 7475 Al Alloy in an Electric Field[J]. Materials Science and Engineering,1990,A129:157-166.
  • 9H Conrad,W D Cao. Effect of Electric Field on Cavitation in Superplastic Al Alloy 7475[J]. Materials Science and Engineering,1991,A138:247-258.
  • 10H Conrad, Z Cuo and A F Sprecher. Effect of an Electric Field on the Recovery and Recrystallize of Al and Cu[J].Scripta Metallurgica,1998,23(6):821-823.

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同被引文献26

  • 1杨敏,邹增大,刘秀忠,刘丽.陶瓷与金属连接的研究进展[J].山东冶金,2004,26(1):37-40. 被引量:11
  • 2金头男,尹志民,肖严庆.LD10合金的时效特性[J].轻合金加工技术,1996,24(9):27-30. 被引量:10
  • 3黄万群,李亚江,王娟,沈孝芹.陶瓷/金属钎焊与扩散连接的研究现状[J].焊接,2007(4):11-13. 被引量:14
  • 4王昊影.铝及铝合金材料、制品生产加工技术与质量检测标准实务全书[M].石家庄:当代音像出版社,2003.683-692.
  • 5顾钰熹,邹耀弟,白闻多.陶瓷与金属的连接[M].北京:化学工业出版社,2009:232-287.
  • 6何鹏.钛/不锈钢相变扩散连接工艺及界面行为的数值分析[D].哈尔滨:哈尔滨工业大学学位论文,1997.
  • 7Shen X Q, Li Y J, Putchkov U A, et al. Finite - element a- nalysis of residual stresses in A12 03-TiC/W18Cr4V diffusion bonded joints [ J ]. Computational Materials Science, 2009, 45:407 - 410.
  • 8Barrena M I, Matesanz L, G6mez J M de Salazar. Al203/ Ti6A14V diffusion bonding joints using Ag-Cu interlayer [ J ]. Materials Characterization ,2009,60 : 1263 - 1267.
  • 9George Wallis. Field assisted glass sealing [ J ]. Electrocom- portent Science and Technology, 1975,1 (2) : 45 - 53.
  • 10Gen Sasaki, Hideharu Fukunaga,Tadatomo Suga, et al. Mech- anism of the anodic bonding between PZT ceramics and sili- con wafer [ J ]. Materials Chemistry and Physics, 1997,51 : 174 - 177.

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