摘要
为了提高镀锡板产品质量,降低生产成本,研究了电镀锡溶液组成、电流密度、温度等电镀工艺条件对镀锡板孔隙率的影响。结果表明:镀锡液各成分对镀锡板孔隙率的影响次序是EN>PSA>ENSA>Sn2+;最优配方是5 g/L ENSA,5 g/L EN,16 g/L PSA,22 g/L Sn2+;随着电流密度从0.5 A/dm2增加到3.0 A/dm2,电沉积的锡晶粒度逐渐细化,孔隙率逐渐降低,至3.0 A/dm2时,锡晶粒度最小,孔隙率也最小;随着镀液温度的升高,镀锡板铁溶出值(PHG)值先减小,后增大,在40℃附近出现了最小值。
The effects of plating bath composition,current density,and temperature on the porosity of electroplated tin coatings were investigated so as to improve the quality and reduce the production cost of tin plates.Furthermore,the optimized composition of the tin electroplating bath was determined.Results show that,according to the effect on the porosity of electroplated tin coatings,various components of the plating bath can be ranked as EN>PSA>ENSA>Sn2+,and the best bath composition is suggested as 5 g/L ENSA,5 g/L EN,16 g/L PSA,and 22 g/L Sn2+.Besides,with the increase of current density,the grains of tin coating tend to be gradually refined,and the porosity gradually tends to decline therewith.Particularly,the tin coating obtained at a current density of 3.0 A/dm2 has the smallest grain size and porosity as well.Moreover,the porosity(PHG value) of electroplated tin coatings rises initially and declines later with elevating plating bath temperature,and the tin coating obtained at a bath temperature of 40 ℃ has the smallest porosity.
出处
《材料保护》
CAS
CSCD
北大核心
2012年第11期31-34,1,共4页
Materials Protection
关键词
电镀锡
孔隙率
镀液组成
温度
电流密度
electroplating of tin coating
porosity
bath composition
temperature
current density
