摘要
DSC作为一种主要的热分析方法,适用于各种固化体系,应用很普遍。文章介绍了DSC的相关基础知识,研究了利用DSC测定LED封装环氧树脂的玻璃化转变温度的测试条件,对不同的测试条件进行了比较和评定,并进行了相关测试。实践表明,在通氮气的前提下,为得到明显的DSC曲线,样品粒径应越小越好,最好为粉末状并压实;样品用量为10mg^15mg左右为宜;仪器升温速率为10K/min^15K/min左右为宜;装在铝坩埚里的待测样品要用工具压实。得到的测试条件对实际测试有指导意义。
As an important heat analysising method, DSC is generally used in all kinds of solidfied systems. In this paper, the basic knowledge of DSC is introduced. And the use of DSC to determine the LED package epoxy glass transition temperature of the test conditions was studied, the comparison and evaluation of the different test conditions, and the test. Practice shows that, under the premise of the nitrogen, in order to obtain obvious DSC curve, the sample particle size should be as small as possible, preferably a powder and compacted; the sample volume of 10mg to 15rag or so is appropriate; the instrument heating rate of 1 OK/ rain-15K/min is appropriate; the sample packed in the aluminum crucible to be tested to be compaction with a tool. The test conditions of the actual test is very instructive.
出处
《电子与封装》
2012年第10期14-18,共5页
Electronics & Packaging
