摘要
文章在介绍半导体金锡焊料封装工艺的基础上,重点对金锡焊料、炉温曲线设置等工艺技术问题进行了深入研究。基于大量的金锡焊料真空焊接封装实验及理论分析,研究了器件气密封装技术。讨论了封焊夹具、管帽镀层、合金状态、封接面表面、压块、焊料厚度以及加热程序对焊接质量的影响。密封后的产品在经过环境试验和机械试验考核后,封装气密性能很好地满足要求。并且结合应用背景证明了所采用的合金及封装工艺的可行性。
In this paper, with the introduction of semiconductor packaging technology of AuSn solder, emphasis on the deep research of technology problems of AuSn solder and temperature curve settings. Based on many vacuum AuSn solder packaging experiments and theoretical analysis,research the technologies of module gas-tight packaging. Discusses the effects of packaging fixture,lid plating layer, alloy state,interface,pressing block,solder thickness and heating process to the solder packaging. The gas-tight performance can be fairly meet after environment mechanism test. The feasibility of alloy used and packaging technique can be proved according to the application background.
出处
《电子与封装》
2012年第10期1-2,13,共3页
Electronics & Packaging
关键词
金锡焊料
真空
炉温曲线
AuSn solder
vacuum
temperature curve
